FILM FORMING METHOD AND FILM FORMING APPARATUS

Title:

FILM FORMING METHOD AND FILM FORMING APPARATUS

Document Type and Number:

WIPO Patent Application WO/2024/029320

Kind Code:

A1

Abstract:

This film forming method comprises: a step for preparing a substrate which comprises a first film that has a first surface and a second film that is different from the first film and has a second surface; a step for selectively forming a graphene-containing film on the second surface; a step for subjecting the substrate after the formation of the graphene-containing film to processing by means of a hydrogen-containing plasma; and a step for selectively forming an object film on the first surface.

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Inventors:

SUZUKI AYUTA (US)
AZUMO SHUJI (JP)
MATSUMOTO TAKASHI (JP)
IFUKU RYOTA (JP)
FUSE TAKASHI (JP)
USUKI TORU (JP)
SUGIURA MASAHITO (JP)

Application Number:

PCT/JP2023/026200

Publication Date:

February 08, 2024

Filing Date:

July 18, 2023

Export Citation:

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Assignee:

TOKYO ELECTRON LTD (JP)

International Classes:

C23C16/26; C23C16/40; H01L21/31; H01L21/316

Domestic Patent References:

WO2021262527A1	2021-12-30
WO2021168134A1	2021-08-26

Foreign References:

JP2019096881A	2019-06-20
US20210082832A1	2021-03-18