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Patent Searching and Data


Title:
FILM FORMING METHOD, CONDUCTIVE FILM AND INSULATING FILM
Document Type and Number:
WIPO Patent Application WO/2014/098157
Kind Code:
A1
Abstract:
To provide a patterned film having high resolution. This film forming method comprises: a step wherein a conductive carbon layer is provided; a step wherein an overcoating layer is provided on the conductive carbon layer; a step wherein a resin layer of a predetermined pattern is provided on the overcoating layer; and a step wherein portions of the conductive carbon layer, on said portions the resin layer being not provided, are irradiated with ultraviolet light in an atmosphere containing oxygen.

Inventors:
MATSUGI Hiroshi (41, Miyukigaoka, Tsukuba-sh, Ibaraki 41, 〒3050841, JP)
MATSUSHIMA Motomi (41, Miyukigaoka, Tsukuba-sh, Ibaraki 41, 〒3050841, JP)
OTAKE Tomiaki (41, Miyukigaoka, Tsukuba-sh, Ibaraki 41, 〒3050841, JP)
Application Number:
JP2013/083982
Publication Date:
June 26, 2014
Filing Date:
December 18, 2013
Export Citation:
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Assignee:
KURARAY CO., LTD. (1621, Sakazu Kurashiki-sh, Okayama 01, 〒7100801, JP)
International Classes:
H01B13/00; C01B31/02; H01B5/14; H01B17/60; H01B19/04; H05K3/10; H05K3/12; H05K3/28
Domestic Patent References:
WO2009035059A1
Foreign References:
JP2011175972A
JP2012164519A
JP2011082092A
Attorney, Agent or Firm:
UDAKA Katsuki et al. (No2 Azuma Bldg. 5fl, 14 Kandasakumacho 1-chome, Chiyoda-k, Tokyo 25, 〒1010025, JP)
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