Title:
FILM FORMING METHOD, CONDUCTIVE FILM AND INSULATING FILM
Document Type and Number:
WIPO Patent Application WO/2014/098157
Kind Code:
A1
Abstract:
To provide a patterned film having high resolution. This film forming method comprises: a step wherein a conductive carbon layer is provided; a step wherein an overcoating layer is provided on the conductive carbon layer; a step wherein a resin layer of a predetermined pattern is provided on the overcoating layer; and a step wherein portions of the conductive carbon layer, on said portions the resin layer being not provided, are irradiated with ultraviolet light in an atmosphere containing oxygen.
Inventors:
MATSUGI HIROSHI (JP)
MATSUSHIMA MOTOMI (JP)
OTAKE TOMIAKI (JP)
MATSUSHIMA MOTOMI (JP)
OTAKE TOMIAKI (JP)
Application Number:
PCT/JP2013/083982
Publication Date:
June 26, 2014
Filing Date:
December 18, 2013
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
H01B13/00; C01B31/02; H01B5/14; H01B17/60; H01B19/04; H05K3/10; H05K3/12; H05K3/28
Domestic Patent References:
| WO2009035059A1 | 2009-03-19 |
Foreign References:
| JP2011175972A | 2011-09-08 | |||
| JP2012164519A | 2012-08-30 | |||
| JP2011082092A | 2011-04-21 |
Attorney, Agent or Firm:
UDAKA Katsuki et al. (JP)
Katsumi Uko (JP)
Katsumi Uko (JP)
Download PDF:
Previous Patent: MEASURING IMPLEMENT, MEASURING SYSTEM AND MEASURING METHOD
Next Patent: FILM FORMING METHOD, CONDUCTIVE FILM, AND INSULATING FILM
Next Patent: FILM FORMING METHOD, CONDUCTIVE FILM, AND INSULATING FILM