Title:
FILM FORMING METHOD, CONDUCTIVE FILM, AND INSULATING FILM
Document Type and Number:
WIPO Patent Application WO/2014/098158
Kind Code:
A1
Abstract:
To provide a patterned film having high resolution. This film forming method comprises: a step wherein a conductive carbon layer is formed; a step wherein an overcoat layer is formed on the conductive carbon layer; a step wherein a mask is disposed on the overcoat layer; and a step wherein the conductive carbon layer is irradiated with ultraviolet light from above the mask in an atmosphere that contains oxygen, while having the mask closely adhered to the overcoat layer.
Inventors:
MATSUSHIMA MOTOMI (JP)
MATSUGI HIROSHI (JP)
OTAKE TOMIAKI (JP)
MATSUGI HIROSHI (JP)
OTAKE TOMIAKI (JP)
Application Number:
PCT/JP2013/083983
Publication Date:
June 26, 2014
Filing Date:
December 18, 2013
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
B32B37/00; B32B9/00; H01B5/14; H01B13/00; H05K3/10; C01B31/02
Domestic Patent References:
| WO2012176905A1 | 2012-12-27 | |||
| WO2012005205A1 | 2012-01-12 |
Foreign References:
| JP2005183636A | 2005-07-07 | |||
| JP2006298715A | 2006-11-02 | |||
| JP2011173429A | 2011-09-08 | |||
| JP2011018542A | 2011-01-27 |
Attorney, Agent or Firm:
UDAKA Katsuki et al. (JP)
Katsumi Uko (JP)
Katsumi Uko (JP)
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