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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2016/208598
Kind Code:
Provided is a film forming method, etc., whereby a powdered material can be rapidly jetted while excessive heating of the powdered material is suppressed in a cold spray method. A film forming method for forming a coating by spray-depositing a powdered material in a solid-phase state onto the surface of a substrate, the film forming method including: a mixing length adjustment step for adjusting the distance between the position of minimum diameter of a penetration passage which decreases in diameter progressively from a proximal-end part to a distal-end part and then increases in diameter, and a mixing position where the powdered material introduced to a nozzle is mixed with a gas, in accordance with the type of the powdered material; a jetting step for mixing the powdered material and a gas at the mixing position and introducing the mixture to the nozzle, accelerating the powdered material and the gas toward the smallest-diameter position, and jetting the powdered material and the gas from the distal-end part of the nozzle; and a spraying step for spraying the powdered material and the gas jetted from the distal-end part onto the substrate.

HIRANO, Satoshi (2-1-49, Numame, Isehara-sh, Kanagawa 26, 〒2591126, JP)
KAWASAKI, Koichi (3-10, Fukuura, Kanazawa-ku, Yokohama-sh, Kanagawa 04, 〒2360004, JP)
Application Number:
Publication Date:
December 29, 2016
Filing Date:
June 21, 2016
Export Citation:
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NHK SPRING CO., LTD. (3-10, Fukuura Kanazawa-ku, Yokohama-sh, Kanagawa 04, 〒2360004, JP)
International Classes:
B05D1/06; B05B7/14; C23C24/04
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (Toranomon Mitsui Building, 8-1 Kasumigaseki 3-chome, Chiyoda-k, Tokyo 13, 〒1000013, JP)
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