Title:
FILM FORMING METHOD AND WINDING TYPE FILM FORMING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/128009
Kind Code:
A1
Abstract:
In order to suppress deformation of a flexible substrate, this film forming method according to an embodiment of the present invention includes a preliminary process in which a vacuum container is exhausted until the moisture pressure inside the vacuum container reaches a target value or less. Plasma is generated by applying an alternating voltage between a first chrome target and a second chrome target disposed inside the vacuum container. A chrome layer is formed on a film forming surface of a flexible substrate disposed so as to face the first chrome target and the second chrome target.
More Like This:
Inventors:
HONMA HIROAKI (JP)
TAKAHASHI HIROHISA (JP)
HASEGAWA MASAKI (JP)
TAKAHASHI HIROHISA (JP)
HASEGAWA MASAKI (JP)
Application Number:
PCT/JP2017/040975
Publication Date:
July 12, 2018
Filing Date:
November 14, 2017
Export Citation:
Assignee:
ULVAC INC (JP)
International Classes:
C23C14/34; C23C14/14; C23C14/56
Domestic Patent References:
| WO2013140997A1 | 2013-09-26 |
Foreign References:
| JP2004197139A | 2004-07-15 | |||
| JP2008240110A | 2008-10-09 | |||
| JP2007247028A | 2007-09-27 | |||
| JP2013075360A | 2013-04-25 |
Attorney, Agent or Firm:
OMORI, Junichi (JP)
Download PDF:
Previous Patent: SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Next Patent: CONTROL DEVICE, CONTROL SYSTEM, AND CONTROL METHOD
Next Patent: CONTROL DEVICE, CONTROL SYSTEM, AND CONTROL METHOD