Title:
FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/081053
Kind Code:
A1
Abstract:
[Problem] To provide a film forming method that enables microparticles having a relatively large particle diameter to be more stably deposited on a substrate by using a simple configuration. [Solution] In the film forming method, microparticles (P) of which at least the surface is insulative are accommodated in a sealed container (2), and a gas is introduced into the sealed container, thereby frictionally electrifying the microparticles and producing an aerosol (A) of the microparticles. The microparticles are electrified by friction with the inner surface of a conveyor pipe (6) connected to the sealed container, and the aerosol is conveyed via the conveyor pipe to a film forming chamber (3) which is maintained at a lower pressure than the sealed container. The electrified microparticles are deposited on a substrate (S) accommodated in the film forming chamber.
Inventors:
FUCHITA EIJI (JP)
TOKIZAKI EIJI (JP)
OZAWA EIICHI (JP)
TOKIZAKI EIJI (JP)
OZAWA EIICHI (JP)
Application Number:
PCT/JP2010/007272
Publication Date:
June 21, 2012
Filing Date:
December 15, 2010
Export Citation:
Assignee:
FUCHITA NANOTECHNOLOGY LTD (JP)
FUCHITA EIJI (JP)
TOKIZAKI EIJI (JP)
OZAWA EIICHI (JP)
FUCHITA EIJI (JP)
TOKIZAKI EIJI (JP)
OZAWA EIICHI (JP)
International Classes:
C23C24/04
Foreign References:
| JP2008240052A | 2008-10-09 | |||
| JP2008075149A | 2008-04-03 | |||
| JP2005089826A | 2005-04-07 | |||
| JP2005290462A | 2005-10-20 |
Attorney, Agent or Firm:
OMORI, JUNICHI (JP)
Omori Junichi (JP)
Omori Junichi (JP)
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Claims: