Title:
FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/128984
Kind Code:
A1
Abstract:
A film forming method having a step in which a unit film forming process is repeated until the thickness of a film formed upon a film-forming target reaches a desired film thickness. The unit film forming process includes: a step (A) in which the film-forming target is placed inside a chamber; a step (B) in which the atmosphere inside the chamber is set to a non-oxidizing gas atmosphere or a vacuum atmosphere; a step (C) in which a film is formed on the film-forming target, by cold spraying in said atmosphere; and a step (D) in which the film-forming target that has had a film formed thereupon is heat treated.
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Inventors:
SAITO MAKOTO (JP)
HIRAMATSU NORIYUKI (JP)
FUKUSHIMA AKIRA (JP)
HIRAMATSU NORIYUKI (JP)
FUKUSHIMA AKIRA (JP)
Application Number:
PCT/JP2013/063901
Publication Date:
August 28, 2014
Filing Date:
May 20, 2013
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
C23C24/04
Foreign References:
| JP2006161161A | 2006-06-22 | |||
| JP2009191349A | 2009-08-27 |
Attorney, Agent or Firm:
KUDOH Minoru (JP)
Minoru Kudo (JP)
Minoru Kudo (JP)
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