Title:
FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/129061
Kind Code:
A1
Abstract:
A film forming method including: a step (A) in which wall members are put against the rim of a film-formation target surface of a base material; a step (B) in which a film is formed by cold spraying, on the film-formation target surface; and a step (C) in which, once a desired thickness has been reached for the film formed upon the film-formation target surface, the wall members are removed. During the process of increasing the thickness of the film by using cold spraying, the side surfaces of the generated film are prevented from forming an inclined surface shape.
Inventors:
SAITO MAKOTO (JP)
HIRAMATSU NORIYUKI (JP)
FUKUSHIMA AKIRA (JP)
HIRAMATSU NORIYUKI (JP)
FUKUSHIMA AKIRA (JP)
Application Number:
PCT/JP2013/083623
Publication Date:
August 28, 2014
Filing Date:
December 16, 2013
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
C23C24/04
Domestic Patent References:
| WO2011145202A1 | 2011-11-24 |
Foreign References:
| JP2007197828A | 2007-08-09 | |||
| JPH0762513A | 1995-03-07 |
Attorney, Agent or Firm:
KUDOH Minoru (JP)
Minoru Kudo (JP)
Minoru Kudo (JP)
Download PDF: