Title:
FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/183827
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a film forming method with which the optimal values of the revolution angular velocity and the rotation angular velocity of a substrate to be treated can be simply set according to a target film thickness. This film forming method of forming a predetermined thin film on a substrate Sw to be treated, by rotating the substrate to be treated around the center Sc of the substrate to be treated while revolving the substrate to be treated around a revolution shaft 22 on the same plane in a vacuum chamber 1, and by supplying a film forming material from film forming sources 31, 32 which are arranged at predetermined positions inside the vacuum chamber and faces the revolved and rotated substrate to be treated, comprises a setting step in which when T is the target film thickness of the thin film to be formed, and D is the film thickness of the thin film to be formed on the substrate in one revolution cycle, the ratio α of the rotation angular velocity Ωrot to the revolution angular velocity Ωrev of the substrate is set to a value satisfying the following equation (1) (however, excluding a case in which the value is an integer multiple or a half-integer multiple). (1): α ≥ 6/log10(T/D)
Inventors:
KODAIRA SHUJI (JP)
TAKAHASHI TEPPEI (JP)
TOBIISHI TAKAHIRO (JP)
YAMAMURA NORIFUMI (JP)
KATAGIRI HIROAKI (JP)
KUBO JUNYA (JP)
SUZUKI MASAAKI (JP)
TAKAHASHI TEPPEI (JP)
TOBIISHI TAKAHIRO (JP)
YAMAMURA NORIFUMI (JP)
KATAGIRI HIROAKI (JP)
KUBO JUNYA (JP)
SUZUKI MASAAKI (JP)
Application Number:
PCT/JP2019/048402
Publication Date:
September 17, 2020
Filing Date:
December 11, 2019
Export Citation:
Assignee:
ULVAC INC (JP)
International Classes:
C23C14/50; C23C14/34; H01L21/285
Foreign References:
JP2002220663A | 2002-08-09 | |||
JPH02210636A | 1990-08-22 | |||
JP2002097570A | 2002-04-02 | |||
JPH01252775A | 1989-10-09 | |||
JP2007039710A | 2007-02-15 |
Attorney, Agent or Firm:
SEIGA PATENT AND TRADEMARK CORPORATION (JP)
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