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Patent Searching and Data


Title:
FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/183827
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a film forming method with which the optimal values of the revolution angular velocity and the rotation angular velocity of a substrate to be treated can be simply set according to a target film thickness. This film forming method of forming a predetermined thin film on a substrate Sw to be treated, by rotating the substrate to be treated around the center Sc of the substrate to be treated while revolving the substrate to be treated around a revolution shaft 22 on the same plane in a vacuum chamber 1, and by supplying a film forming material from film forming sources 31, 32 which are arranged at predetermined positions inside the vacuum chamber and faces the revolved and rotated substrate to be treated, comprises a setting step in which when T is the target film thickness of the thin film to be formed, and D is the film thickness of the thin film to be formed on the substrate in one revolution cycle, the ratio α of the rotation angular velocity Ωrot to the revolution angular velocity Ωrev of the substrate is set to a value satisfying the following equation (1) (however, excluding a case in which the value is an integer multiple or a half-integer multiple). (1): α ≥ 6/log10(T/D)

Inventors:
KODAIRA SHUJI (JP)
TAKAHASHI TEPPEI (JP)
TOBIISHI TAKAHIRO (JP)
YAMAMURA NORIFUMI (JP)
KATAGIRI HIROAKI (JP)
KUBO JUNYA (JP)
SUZUKI MASAAKI (JP)
Application Number:
PCT/JP2019/048402
Publication Date:
September 17, 2020
Filing Date:
December 11, 2019
Export Citation:
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Assignee:
ULVAC INC (JP)
International Classes:
C23C14/50; C23C14/34; H01L21/285
Foreign References:
JP2002220663A2002-08-09
JPH02210636A1990-08-22
JP2002097570A2002-04-02
JPH01252775A1989-10-09
JP2007039710A2007-02-15
Attorney, Agent or Firm:
SEIGA PATENT AND TRADEMARK CORPORATION (JP)
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