Title:
FILM HAVING PLATED-LAYER PRECURSOR LAYER, FILM HAVING PATTERNED PLATED LAYER, ELECTROCONDUCTIVE FILM, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2017/154786
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a film having a plated-layer precursor layer in which it is possible to form a metal layer that has exceptional roll-to-roll production properties and exceptional adhesiveness with respect to a substrate. The present invention also addresses the problem of providing a film having a patterned plated layer, as well as an electroconductive film and a touch panel in which the film having a patterned plated layer is used. This film having a plated-layer precursor layer has a substrate, and an undercoat layer and a plated-layer precursor layer disposed on the substrate in the stated order from the substrate side, wherein the hardness of the surface of the undercoat layer is 10 N/mm2 or less, and the coefficient of friction of the undercoat layer with respect to a release paper is 5 or less.
Inventors:
ICHIKI TAKAHIKO (JP)
TSUKAMOTO NAOKI (JP)
SENGA TAKESHI (JP)
KASAHARA TAKEHIRO (JP)
TERAO YUKO (JP)
KANAYAMA SHUUJI (JP)
TSUKAMOTO NAOKI (JP)
SENGA TAKESHI (JP)
KASAHARA TAKEHIRO (JP)
TERAO YUKO (JP)
KANAYAMA SHUUJI (JP)
Application Number:
PCT/JP2017/008551
Publication Date:
September 14, 2017
Filing Date:
March 03, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B7/02; B32B15/08; C23C18/18; C23C18/31; H05K3/18
Foreign References:
JP2013041942A | 2013-02-28 | |||
JP2014108531A | 2014-06-12 | |||
JP2009015155A | 2009-01-22 | |||
JPS543843A | 1979-01-12 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Download PDF: