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Patent Searching and Data


Title:
FILM HAVING PLATED-LAYER PRECURSOR LAYER, FILM HAVING PATTERNED PLATED LAYER, ELECTROCONDUCTIVE FILM, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2017/154786
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a film having a plated-layer precursor layer in which it is possible to form a metal layer that has exceptional roll-to-roll production properties and exceptional adhesiveness with respect to a substrate. The present invention also addresses the problem of providing a film having a patterned plated layer, as well as an electroconductive film and a touch panel in which the film having a patterned plated layer is used. This film having a plated-layer precursor layer has a substrate, and an undercoat layer and a plated-layer precursor layer disposed on the substrate in the stated order from the substrate side, wherein the hardness of the surface of the undercoat layer is 10 N/mm2 or less, and the coefficient of friction of the undercoat layer with respect to a release paper is 5 or less.

Inventors:
ICHIKI TAKAHIKO (JP)
TSUKAMOTO NAOKI (JP)
SENGA TAKESHI (JP)
KASAHARA TAKEHIRO (JP)
TERAO YUKO (JP)
KANAYAMA SHUUJI (JP)
Application Number:
PCT/JP2017/008551
Publication Date:
September 14, 2017
Filing Date:
March 03, 2017
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B7/02; B32B15/08; C23C18/18; C23C18/31; H05K3/18
Foreign References:
JP2013041942A2013-02-28
JP2014108531A2014-06-12
JP2009015155A2009-01-22
JPS543843A1979-01-12
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
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