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Patent Searching and Data


Title:
FILM LAMINATE BODY, METHOD FOR MANUFACTURING SAME, AND FILM-FORMING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/185938
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a film laminate body equipped with an inorganic layer and an organic layer that have high adhesion, a method for manufacturing the same, and a film-forming device. This film laminate body is equipped, on a base film, with a inorganic layer containing a metal compound, and an organic layer adjacent to the inorganic layer, and is characterized in that the organic layer contains the same metal as the metal in the metal compound, and the average content of the metal in the thickness direction of the organic layer is within the range of 0.1-1,000 mass ppm.

Inventors:
KAWAMURA TOMONORI (JP)
SAKKA KENJI (JP)
Application Number:
PCT/JP2016/063809
Publication Date:
November 24, 2016
Filing Date:
May 10, 2016
Export Citation:
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Assignee:
KONICA MINOLTA INC (JP)
International Classes:
B32B9/00; C23C14/56; C23C16/455; C23C16/54
Foreign References:
JP2004160836A2004-06-10
JP2005537963A2005-12-15
JP2007230115A2007-09-13
JP2007090803A2007-04-12
JP2014088016A2014-05-15
JPH08318590A1996-12-03
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
特許業務法人光陽国際特許事務所 (JP)
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