Title:
FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SEMICONDUCTOR MOUNTING SUBSTRATE WITH FILM LAYER, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/262581
Kind Code:
A1
Abstract:
A film includes a propenyl group-containing resin (A) including a structural unit represented by the following formula (1) at the end of a molecule, a radically polymerizable resin or compound (B) other than the propenyl group-containing resin (A), and a curing accelerator (C), wherein the radically polymerizable resin or compound (B) includes a maleimide group and/or a citraconimide group. In formula (1), -* indicates atomic bonding.
Inventors:
SEKIDO TAKAHITO (JP)
OKANIWA MASASHI (JP)
SUGIYAMA GENKI (JP)
TAKANO KENTARO (JP)
KIDA TSUYOSHI (JP)
OKANIWA MASASHI (JP)
SUGIYAMA GENKI (JP)
TAKANO KENTARO (JP)
KIDA TSUYOSHI (JP)
Application Number:
PCT/JP2020/025143
Publication Date:
December 30, 2020
Filing Date:
June 26, 2020
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/22; C08F212/34; C08F222/40; H01L21/60
Domestic Patent References:
| WO2018212116A1 | 2018-11-22 |
Foreign References:
| US4826929A | 1989-05-02 | |||
| JP2002030041A | 2002-01-29 | |||
| JP2015503220W | ||||
| JP2014521754W | ||||
| JP2013112730A | 2013-06-10 | |||
| JP2003221443A | 2003-08-05 | |||
| JP2016196548A | 2016-11-24 | |||
| JP2013008800A | 2013-01-10 | |||
| JP2011157529A | 2011-08-18 | |||
| JP2006245242A | 2006-09-14 | |||
| JP2019122429A | 2019-07-25 |
Other References:
See also references of EP 3992231A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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