Title:
FILM LAMINATING METHOD AND LAMINATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2003/049925
Kind Code:
A1
Abstract:
A film laminating method in which when a film is laminated on a substrate, a sound wave of a predetermined frequency is applied at least to one of the film and the substrate. Since elastic deformation, plastic deformation, interatomic bond between the substrate and film, frictional heat are caused by the acoustic vibration energy action, adhesion of the film to the substrate and the roughness coverage can be sufficiently enhanced. A high level of embeddability of the film in the rough portion of the substrate can be achieved.
Inventors:
TSUCHIYA KATSUNORI (JP)
OZAWA KYOUKO (JP)
OZAWA KYOUKO (JP)
Application Number:
PCT/JP2002/012888
Publication Date:
June 19, 2003
Filing Date:
December 10, 2002
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
TSUCHIYA KATSUNORI (JP)
OZAWA KYOUKO (JP)
TSUCHIYA KATSUNORI (JP)
OZAWA KYOUKO (JP)
International Classes:
B29C65/08; B29C63/02; (IPC1-7): B29C65/06; B29C65/08
Foreign References:
| JP2001334575A | 2001-12-04 | |||
| JPH079564A | 1995-01-13 | |||
| JP3049867Y2 | ||||
| US4400227A | 1983-08-23 | |||
| JPS6212579Y2 | 1987-04-01 | |||
| JPH04371827A | 1992-12-24 | |||
| JPS6260645A | 1987-03-17 | |||
| JPS55148486A | 1980-11-19 |
Attorney, Agent or Firm:
Hasegawa, Yoshiki (Okura-honkan 6-12, Ginza 2-chom, Chuo-ku Tokyo, JP)
Download PDF: