Title:
FILM AND LAYERED BODY
Document Type and Number:
WIPO Patent Application WO/2024/048348
Kind Code:
A1
Abstract:
The present invention provides a film that has a layer A having a thermal expansion coefficient of 30 to 70 ppm/K and a void percentage of 20 to 60 vol%. Also provided is a layered body that uses this film.
Inventors:
YAMAZAKI SHOHEI (JP)
SASADA YASUYUKI (JP)
IKEDA HITOSHI (JP)
SASADA YASUYUKI (JP)
IKEDA HITOSHI (JP)
Application Number:
PCT/JP2023/029985
Publication Date:
March 07, 2024
Filing Date:
August 21, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08J9/28; B32B5/18; B32B15/09; B32B27/36; C08J5/18; H05K1/03
Domestic Patent References:
| WO2022114159A1 | 2022-06-02 | |||
| WO2022163776A1 | 2022-08-04 | |||
| WO2022071525A1 | 2022-04-07 | |||
| WO2016143523A1 | 2016-09-15 |
Foreign References:
| JPH11508634A | 1999-07-27 | |||
| JP2022085734A | 2022-06-08 | |||
| JP2021030631A | 2021-03-01 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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