FILM-LIKE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, FILM-LIKE ADHESIVE PRODUCTION METHOD, SEMICONDUCTOR PACKAGE USING FILM-LIKE ADHESIVE, AND PRODUCTION METHOD THEREFOR

Title:

FILM-LIKE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, FILM-LIKE ADHESIVE PRODUCTION METHOD, SEMICONDUCTOR PACKAGE USING FILM-LIKE ADHESIVE, AND PRODUCTION METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2017/158994

Kind Code:

A1

Abstract:

A film-like adhesive composition containing each of an epoxy resin, an epoxy resin curing agent, a phenoxy resin and an aluminum nitride filler, wherein the content of the aluminum nitride filler is 30-60% with respect to the total amount of the epoxy resin, the epoxy resin curing agent, the phenoxy resin, and the aluminum nitride filler, when the film adhesive obtained by the film-like adhesive composition is heated from 25°C at a rate of temperature rise of 5°C/min, a minimum melt viscosity in the range of 200-10,000 Pa∙s is reached at 80°C or higher, a cured body having a thermal conductivity of 1.0 W/m·K or more is given after curing, and the electrical conductivity of extracted water extracted in pure water at 121°C for 20 hours after curing is 50 µS/cm or more; a film-like adhesive; a film-like adhesive production method; a semiconductor package, and a production method therefor.

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Inventors:

MORITA MINORU (JP)
KIRIKAE NORIYUKI (JP)
SANO TORU (JP)

Application Number:

PCT/JP2016/089006

Publication Date:

September 21, 2017

Filing Date:

December 27, 2016

Export Citation:

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Assignee:

FURUKAWA ELECTRIC CO LTD (JP)

International Classes:

C09J163/00; C09J7/10; C09J11/04; C09J11/06; C09J171/10; H01L21/52

Domestic Patent References:

WO2012147999A1

2012-11-01

Foreign References:

JP2012207222A	2012-10-25
JP2010116453A	2010-05-27
JP2008106231A	2008-05-08
JP2013030504A	2013-02-07
JP2010205498A	2010-09-16
JP2014225682A	2014-12-04

Attorney, Agent or Firm:

IIDA, Toshizo et al. (JP)

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