Title:
FILM-LIKE ADHESIVE, LAMINATE SHEET, COMPOSITE SHEET, AND MANUFACTURING METHOD FOR LAMINATE
Document Type and Number:
WIPO Patent Application WO/2020/137947
Kind Code:
A1
Abstract:
A film-like adhesive of this embodiment is for bonding a circuit formation surface of a chip to a light-transmissive cover. At least one surface of the film-like adhesive does not substantially include an aromatic compound.
Inventors:
SATO YOSUKE (JP)
Application Number:
PCT/JP2019/050300
Publication Date:
July 02, 2020
Filing Date:
December 23, 2019
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B32B27/30; B32B27/38; B32B27/40; C09J7/35; C09J7/38; C09J11/06; C09J133/00; C09J163/00; C09J175/04; H01L21/301; H01L21/52; H01L23/29; H01L27/146
Foreign References:
| JP2008063551A | 2008-03-21 | |||
| JP2015195265A | 2015-11-05 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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