Title:
FILM-LIKE ADHESIVE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/158594
Kind Code:
A1
Abstract:
Provided is a film-like adhesive 1 for connecting a circuit, the film-like adhesive 1 containing: solder particles 2 having a Bi content of 20-60 mass% and an Sn content of 40-80 mass%; a radically polymerizable compound; and a thermal radical-generating agent, wherein the average particle diameter of the solder particles 2 is 0.6-1.5 times the thickness d1 of the film-like adhesive.
More Like This:
Inventors:
KIKUCHI KENTA (JP)
IZAWA HIROYUKI (JP)
TOMISAKA KATSUHIKO (JP)
SATO MAYUMI (JP)
OKOSHI MASASHI (JP)
TAKAIRA HIROSHI (JP)
MATSUZAKI TOSHIAKI (JP)
HOSHI KATSUAKI (JP)
IZAWA HIROYUKI (JP)
TOMISAKA KATSUHIKO (JP)
SATO MAYUMI (JP)
OKOSHI MASASHI (JP)
TAKAIRA HIROSHI (JP)
MATSUZAKI TOSHIAKI (JP)
HOSHI KATSUAKI (JP)
Application Number:
PCT/JP2022/002460
Publication Date:
July 28, 2022
Filing Date:
January 24, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J4/00; C09J7/30; C09J9/02; C09J11/04; C09J11/06; H05K1/14; H05K3/32
Domestic Patent References:
| WO2017090659A1 | 2017-06-01 | |||
| WO2017170371A1 | 2017-10-05 |
Foreign References:
| JP2019044043A | 2019-03-22 | |||
| JP2000133681A | 2000-05-12 | |||
| JP2012079880A | 2012-04-19 | |||
| JP2017120839A | 2017-07-06 | |||
| JP2020024937A | 2020-02-13 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: