Title:
FILM-LIKE ADHESIVE, PROCESS FOR PRODUCING THE SAME, ADHESIVE SHEET AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2004/111148
Kind Code:
A1
Abstract:
A die bonding film-like adhesive capable of being laminated on the rear surface of a wafer at a temperature lower than the softening point of a protective tape for an extremely thin wafer or a dicing tape being pasted while reducing thermal stress, e.g. warp, of the wafer and simplifying production process of a semiconductor device and exhibiting excellent heat resistance and reliability of moisture resistance; an adhesive sheet being produced by pasting the film-like adhesive and the dicing tape; and a semiconductor device.
Inventors:
MASUKO TAKASHI (JP)
OOKUBO KEISUKE (JP)
HATAKEYAMA KEIICHI (JP)
YUSA MASAMI (JP)
OOKUBO KEISUKE (JP)
HATAKEYAMA KEIICHI (JP)
YUSA MASAMI (JP)
Application Number:
PCT/JP2004/008472
Publication Date:
December 23, 2004
Filing Date:
June 10, 2004
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
MASUKO TAKASHI (JP)
OOKUBO KEISUKE (JP)
HATAKEYAMA KEIICHI (JP)
YUSA MASAMI (JP)
MASUKO TAKASHI (JP)
OOKUBO KEISUKE (JP)
HATAKEYAMA KEIICHI (JP)
YUSA MASAMI (JP)
International Classes:
C09J7/10; H01L21/58; H01L21/68; H01L21/00; (IPC1-7): C09J7/00; C09J7/02; H01L21/52; H01L21/301
Foreign References:
| JPH08151554A | 1996-06-11 | |||
| JPH09279121A | 1997-10-28 |
Attorney, Agent or Firm:
Miyoshi, Hidekazu (2-8 Toranomon 1-chom, Minato-ku Tokyo, JP)
Download PDF:
Previous Patent: CYANOACRYLATE COMPOSITIONS
Next Patent: ANTIFOULING TAPE AND METHOD OF APPLICATION THEREOF
Next Patent: ANTIFOULING TAPE AND METHOD OF APPLICATION THEREOF