Title:
FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, SEMICONDUCTOR DEVICE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/225191
Kind Code:
A1
Abstract:
This film-like adhesive for semiconductors is provided with a first layer which comprises a first adhesive containing a flux compound, and a second layer which is provided upon the first layer and comprises a second adhesive containing substantially no flux compound.
Inventors:
AKIYOSHI TOSHIYASU (JP)
Application Number:
PCT/JP2017/021143
Publication Date:
December 13, 2018
Filing Date:
June 07, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J7/00; C09J4/02; C09J11/06; C09J201/00; H01L21/60
Domestic Patent References:
WO2016117350A1 | 2016-07-28 | |||
WO2012153846A1 | 2012-11-15 |
Foreign References:
JP2012184288A | 2012-09-27 | |||
JP2012195414A | 2012-10-11 | |||
JP2012241162A | 2012-12-10 | |||
JP2013185124A | 2013-09-19 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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