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Patent Searching and Data


Title:
FILM-LIKE ADHESIVE, ADHESIVE SHEET FOR SEMICONDUCTOR JUNCTION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/021450
Kind Code:
A1
Abstract:
This film-like adhesive contains a binder resin (A), epoxy resin (B), hardener (C), and filler (D), wherein the total light transmittance in a D65 standard light source is 70% or higher and the haze value is 50% or lower. Provided are a film-like adhesive that makes it possible to die bond semiconductor chips accurately at predetermined positions in flip mounting as well as to produce semiconductor devices having high package reliability, and an adhesive sheet for a semiconductor junction using the adhesive.

Inventors:
WAKAYAMA YOJI (JP)
ICHIKAWA ISAO (JP)
AKUTSU TAKASHI (JP)
Application Number:
PCT/JP2013/070990
Publication Date:
February 06, 2014
Filing Date:
August 02, 2013
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
C09J201/00; C09J7/22; C09J7/30; C09J11/04; C09J133/00; C09J163/00; H01L21/301; H01L21/60
Domestic Patent References:
WO2011040064A12011-04-07
Foreign References:
JP2010074144A2010-04-02
JP2008260908A2008-10-30
JP2003171475A2003-06-20
JPH09253964A1997-09-30
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
Maeda and a Suzuki international patent business corporation (JP)
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