Title:
FILM MANUFACTURING METHOD, FILM MANUFACTURING DEVICE, AND JIG
Document Type and Number:
WIPO Patent Application WO/2014/084306
Kind Code:
A1
Abstract:
A rectifying jig (10) is configured so as not to cover a lip opening part (3) of a multilayer extrusion die (1), but so as to cover a seal part (6) at a location adjacent to both longitudinal-direction ends of the lip opening part (3), and thereby a film is formed by extruding resin from the lip opening part (3).
Inventors:
URABE TAKASHI (JP)
KANESHIRO HISAYASU (JP)
HANADA KOJI (JP)
KANESHIRO HISAYASU (JP)
HANADA KOJI (JP)
Application Number:
PCT/JP2013/082038
Publication Date:
June 05, 2014
Filing Date:
November 28, 2013
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
B29C48/08; B29C48/305; B29C48/31; B29K79/00
Foreign References:
| JPS6067129A | 1985-04-17 | |||
| JPH09201866A | 1997-08-05 | |||
| JP2000015683A | 2000-01-18 | |||
| JPH0538477A | 1993-02-19 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
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