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Title:
FILM AND METHOD FOR PRODUCING FILM
Document Type and Number:
WIPO Patent Application WO/2018/198864
Kind Code:
A1
Abstract:
A film characterized by having a stress at 5% elongation at 25°C, Ta, of 1.0-20.0 MPa. In cases when dimensional change at 90°C during heating from 25°C to 160°C at a rate of 10 °C/min under a load of 120 g/mm2 is referred to as 90°C dimensional change 1 and when the direction in which the 90°C dimensional change 1 is maximum is referred to as X direction, the direction which is perpendicular to the X direction within the plane of the film is referred to as Y direction, and the X-direction 90°C dimensional change is expressed by T×1 (%), then the film is characterized in that T×1 is -10.00% or greater but not greater than 10.00%. The film has both heat resistance sufficient for maintaining the flatness in heating steps and flexibility sufficient for uses as a dicing pressure-sensitive adhesive film, etc., and is suitable for use as a substrate for semiconductor production steps.

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Inventors:
SHOJI HIDEO (JP)
TANAKA TERUYA (JP)
MANABE ISAO (JP)
Application Number:
PCT/JP2018/015750
Publication Date:
November 01, 2018
Filing Date:
April 16, 2018
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08J5/18; B29C55/12; B32B27/00
Foreign References:
JP2005336428A2005-12-08
JP2005306924A2005-11-04
JPH04268338A1992-09-24
JP2003342393A2003-12-03
JP2011231241A2011-11-17
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