FILM AND MOLD RELEASE FILM

WIPO Patent Application WO/2008/001682

A1

A film that has a layer of specified 4-methyl-1-pentene copolymer and has a specified thickness buildup and thermal shrinkage coefficient. There is provided a film excelling in heat resistance and mold release properties, especially a film suitable for use as a mold release film applied in producing of a laminate according to pressure molding. When this film is used as a mold release film in the heating and pressurization steps for manufacturing of flexible printed boards, there can be prevented sticking of coverlay to metal sheet and outflow of adhesive leading to sticking to other members. Moreover, there can be avoided generation of voids in non-printed portions on the board, and contamination of exposed portions, such as terminal portions, of electric circuit by melting outflow of adhesive. Still further, wrinkling of the mold release film can be avoided, so that generation of voids due to follow failure of the mold release film can be avoided and that thus flexible printed boards with good appearance can be obtained.

TANIZAKI TATSUYA (JP)

PCT/JP2007/062575

January 03, 2008

June 22, 2007

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MITSUI CHEMICALS INC (JP)
TANIZAKI TATSUYA (JP)

C08J5/18; B32B27/32; C08F210/14

WO2006067964A1

2006-06-29

JPH02175247A	1990-07-06
JP2002225207A	2002-08-14
JPH02238911A	1990-09-21
JP2002252458A	2002-09-06
JP2000289170A	2000-10-17
JP2006212954A	2006-08-17

SUZUKI, Shunichiro (Gotanda Yamazaki Bldg. 6F13-6, Nishigotanda 7-chome, Shinagawa-k, Tokyo 31, JP)

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