Title:
FILM OPTICAL WAVEGUIDE AND METHOD FOR MANUFACTURE THEREOF, AND ELECTRONIC INSTRUMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2006/001447
Kind Code:
A1
Abstract:
An under clad layer (26) having a concave groove (25) and a flat upper clad layer (30) are provided. A polymer adhesive (27) having a refractive index greater than that of the under clad layer (26) is applied on the under clad layer (26). The polymer adhesive (27) is a mixture of a polymerization initiator and a precursor, comprising a monomer and an oligomer, of a polymer exhibiting a flexural modulus of elasticity of 1,000 MPa after curing and containing a hydrogen bond group in functional groups thereof, wherein the hydrogen bond group is a carbonyl group, an amino group, an imino group, or a hydroxyl group. Then, the polymer adhesive (27) is pressed and spread with the upper clad layer (30), to effect the polymer adhesive (27) and thereby form a core (28) and simultaneously join the under clad layer (26) and the upper clad layer (30) by the polymer adhesive (27), which results in the manufacture of a film optical waveguide being less prone to delamination at the interface between clad layers.
Inventors:
ISHIDA YOSHIHISA (JP)
ENAMI AKIRA (JP)
FUJISAKI TAMIO (JP)
HOSOKAWA HAYAMI (JP)
ENAMI AKIRA (JP)
FUJISAKI TAMIO (JP)
HOSOKAWA HAYAMI (JP)
Application Number:
PCT/JP2005/011824
Publication Date:
January 05, 2006
Filing Date:
June 28, 2005
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
ISHIDA YOSHIHISA (JP)
ENAMI AKIRA (JP)
FUJISAKI TAMIO (JP)
HOSOKAWA HAYAMI (JP)
ISHIDA YOSHIHISA (JP)
ENAMI AKIRA (JP)
FUJISAKI TAMIO (JP)
HOSOKAWA HAYAMI (JP)
International Classes:
G02B6/12; G02B6/13; (IPC1-7): G02B6/12; G02B6/13
Foreign References:
| JPH07239422A | 1995-09-12 |
Other References:
ISHIDA Y. ET AL, 2004 NEN SHUKI DAI 65 KAI EXTENDED ABSTRACTS; THE JAPAN SOCIETY OF APPLIED PHYSICS, vol. 3, 1 September 2004 (2004-09-01), pages 1037, XP002996697
ENMI A. ET AL, 2004 NEN THE INSTITUTE OF ELECTRONICS, INFORMATION AND COMMUNICATION ENGINEERS ELECTRONICS SOCIETY TAIKAI KOEN RONBUNSHU, vol. 1, 8 September 2004 (2004-09-08), pages 207, XP002996698
See also references of EP 1762869A4
ENMI A. ET AL, 2004 NEN THE INSTITUTE OF ELECTRONICS, INFORMATION AND COMMUNICATION ENGINEERS ELECTRONICS SOCIETY TAIKAI KOEN RONBUNSHU, vol. 1, 8 September 2004 (2004-09-08), pages 207, XP002996698
See also references of EP 1762869A4
Attorney, Agent or Firm:
Nakano, Masayoshi (3-5 Tanimachi 1-chome, Chuo-ku, Osaka-sh, Osaka 12, JP)
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