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Patent Searching and Data


Title:
FILM PATTERN WRITING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/208858
Kind Code:
A1
Abstract:
Provided is a film pattern writing method which makes it possible to suppress defect variations even when a defective nozzle develops during coating, and to form a film pattern without increasing the number of nozzles more than is necessary. Specifically, a film pattern is formed by: an initial film forming step of forming an initial film corresponding to a nozzle position by ejecting droplets while a head scans in a main scan direction; a main shift movement step of causing the head to be moved in a sub-scan direction orthogonal to the main scan direction, beyond the nozzle position of an adjacent nozzle; a sub-shift movement step of causing the head to be moved further from the main shift movement step by an amount of movement smaller than a nozzle arrangement pitch; a shift film forming step of forming, at a shift nozzle position after the main shift movement step and the sub-shift movement step, a film corresponding to the shift nozzle position by ejecting droplets from the nozzles while the head scans in the main scan direction; and, after the initial film forming step, repeating the main shift movement step, the sub-shift step, and the shift film forming step in that order.

Inventors:
FUKUSHIMA, Yugo (1-45, Oe 1-chome, Otsu-sh, Shiga 41, 〒5202141, JP)
Application Number:
JP2017/018856
Publication Date:
December 07, 2017
Filing Date:
May 19, 2017
Export Citation:
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Assignee:
TORAY ENGINEERING CO., LTD. (Yaesu Ryumeikan Bldg, 3-22 Yaesu 1-chome, Chuo-k, Tokyo 28, 〒1030028, JP)
International Classes:
B05D1/26; B41J2/01; B05C5/00
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