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Title:
FILM-PEELING METHOD, PROCESS FOR PRODUCTION OF OPTICAL FILM, FILM-PEELING MECHANISM, AND APPARATUS FOR PRODUCTION OF OPTICAL FILM
Document Type and Number:
WIPO Patent Application WO/2010/038697
Kind Code:
A1
Abstract:
A method for peeling a light-release film continuously from a substrate-less, double-sided, pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer which is laminated with the light-release film on one side of the pressure-sensitive adhesive layer and with a heavy-release film on the other side thereof.  The method includes: applying at least one roll for changing the direction of conveyance to a substrate-less, double-sided, pressure-sensitive adhesive sheet; peeling a light-release film from the substrate-less, double-sided, pressure-sensitive adhesive sheet along the contact line between the substrate-less, double-sided, pressure -sensitive adhesive sheet and the roll, while changing, along the roll, the direction of conveyance of the light-release film and/or the direction of conveyance of the substrate-less, double-sided, pressure-sensitive adhesive sheet from which the light-release film has been removed; and adjusting the angle (θ1) between the release side of the light-release film and the release side of the substrate-less, double-sided, pressure -sensitive adhesive sheet from which the light-release film has been removed to 28 degrees or above.  In peeling a light-release film from a substrate-less double-sided pressure-sensitive adhesive sheet, the method enables stable release and suppresses the adhesion of an adhesive to the light-release film.

Inventors:
INAO, Youichi (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
稲男 洋一 (〒01 東京都板橋区本町23番23号 リンテック株式会社内 Tokyo, 〒1730001, JP)
ETOH, Hiroyuki (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
衛藤 広行 (〒01 東京都板橋区本町23番23号 リンテック株式会社内 Tokyo, 〒1730001, JP)
KANDA, Toshimitsu (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
Application Number:
JP2009/066759
Publication Date:
April 08, 2010
Filing Date:
September 28, 2009
Export Citation:
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Assignee:
LINTEC CORPORATION (23-23, Honcho Itabashi-k, Tokyo 01, 〒1730001, JP)
リンテック株式会社 (〒01 東京都板橋区本町23番23号 Tokyo, 〒1730001, JP)
INAO, Youichi (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
稲男 洋一 (〒01 東京都板橋区本町23番23号 リンテック株式会社内 Tokyo, 〒1730001, JP)
ETOH, Hiroyuki (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
衛藤 広行 (〒01 東京都板橋区本町23番23号 リンテック株式会社内 Tokyo, 〒1730001, JP)
International Classes:
B65H41/00; B32B7/10; B32B37/00; B65H35/07; B65H37/04; C09J5/00; C09J7/00
Foreign References:
JPH06340368A
JPH06322327A
JP2005059241A
JPH11170775A
JPH0853264A
JPH04293983A
JPH0741736A
JP2004231723A
JP2003020453A
Attorney, Agent or Firm:
OHTANI, Tamotsu (OHTANI PATENT OFFICE, Bridgestone Toranomon Bldg. 6F. 25-2, Toranomon 3-chome, Minato-k, Tokyo 01, 〒1050001, JP)
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