Title:
FILM FOR PRINT LAMINATION AND PROCESS FOR CONTACT BONDING THEREOF BY HEATING
Document Type and Number:
WIPO Patent Application WO/1987/006188
Kind Code:
A1
Abstract:
A film for print lamination which comprises a base film and a heat-sensitive adhesive resin layer composed of polyethylene, a copolymer containing at least 70 wt % ethylene, or a polymer mixture containing a total of at least 70 wt % of ethylene and subjected to corona discharge surface treatment in a nitrogen gas atmosphere containing less than 20.9 volume % of oxygen. When the heat-sensitive adhesive resin layer is incorporated with 0.2 to 5 wt % of white fine powder of 0.2 to 20 mum in average particle size and contact-bonded against a material to be laminated by heating, no changes in finish and color tone of a print are observed after lamination.
Inventors:
YAMAMOTO TAKESHI (JP)
KONDO KUNIO (JP)
YOSHIMURA HIROSHI (JP)
WADA YOSHIHIRO (JP)
WADA FUSAZO (JP)
KONDO KUNIO (JP)
YOSHIMURA HIROSHI (JP)
WADA YOSHIHIRO (JP)
WADA FUSAZO (JP)
Application Number:
PCT/JP1987/000197
Publication Date:
October 22, 1987
Filing Date:
March 30, 1987
Export Citation:
Assignee:
GUNZE KK (JP)
International Classes:
C08J5/12; B29C65/02; B32B27/28; B32B27/32; B41M7/00; B29K23/00; B29L9/00; (IPC1-7): B32B27/32; B29C65/02
Foreign References:
| JPS59192565A | 1984-10-31 | |||
| JPS5967233U | 1984-05-07 | |||
| JPS5924666A | 1984-02-08 |
Other References:
See also references of EP 0263882A4
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