Title:
FILM PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, SEMICONDUCTOR DEVICE PRODUCTION METHOD, AND FILM FORMATION COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/163860
Kind Code:
A1
Abstract:
This film production method includes a step for performing slit coating on a member, which at least partially contains a metal, by using a composition containing: a polyimide precursor; at least two solvents having different solubilities at 23°C for the polyimide precursor; and at least one selected from the group consisting of a surfactant and a plasticizer. The present invention further pertains to a laminate production method, a semiconductor device production method and a film formation composition that relate to said film production method.
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Inventors:
SAWANO MITSURU (JP)
FUKUHARA KEI (JP)
MASUDA SEIYA (JP)
SHIMADA KAZUTO (JP)
FUKUHARA KEI (JP)
MASUDA SEIYA (JP)
SHIMADA KAZUTO (JP)
Application Number:
PCT/JP2019/006428
Publication Date:
August 29, 2019
Filing Date:
February 21, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C23C26/00; B05C5/02; B05D1/26; B05D3/00; G03F7/004; G03F7/027; G03F7/037; G03F7/16
Domestic Patent References:
| WO2017146152A1 | 2017-08-31 | |||
| WO2015046128A1 | 2015-04-02 |
Foreign References:
| JP2003260404A | 2003-09-16 | |||
| JP2009045602A | 2009-03-05 | |||
| JP2005057000A | 2005-03-03 | |||
| JPH0768728A | 1995-03-14 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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