Title:
FILM AND PRODUCTION METHOD FOR FILM
Document Type and Number:
WIPO Patent Application WO/2020/045138
Kind Code:
A1
Abstract:
A film having a thickness of 20 μm or less, an elastic modulus of 2,000 MPa or greater, and an elongation at break of 20% or greater. Preferably, in an edge portion of the film, the number of cracks having a length of 30 μm or larger is less than one per mm of the edge portion.
Inventors:
INOUE KYOSUKE (JP)
Application Number:
PCT/JP2019/032240
Publication Date:
March 05, 2020
Filing Date:
August 19, 2019
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
C08J5/18; B23K26/38; C08G61/06; G02B5/30
Domestic Patent References:
| WO2016031776A1 | 2016-03-03 | |||
| WO2016080342A1 | 2016-05-26 |
Foreign References:
| JP2016138280A | 2016-08-04 | |||
| JP2013105834A | 2013-05-30 | |||
| JP2016206641A | 2016-12-08 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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