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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2019/150645
Kind Code:
The invention allows a protective film to be released from a brittle material substrate via a simple configuration. In this invention, a brittle material substrate is adhered onto a substrate-holding tape which has been stretched and adhered onto a flat and circular holding ring thereby yielding an object for processing. A protective film is adhered onto the object for processing in such a manner as to cover one of the main surfaces of the substrate entirely, while reaching with the outer peripheral end portion thereof the vicinity of the edge portion on the inner peripheral side of the holding ring. A mechanism for releasing the protective film from the object for processing comprises: a horizontal transport means for transporting the object for processing in a first orientation within a horizontal plane; and a film-gripping mechanism capable of gripping, symmetrically with respect to the first orientation, parts for gripping, which are parts in the outer peripheral edge portion of the protective film, while the object for processing is in a horizontally oriented state wherein the upper surface is on the side whereon the protective film has been adhered. In a state wherein the film gripping mechanism has gripped the parts for gripping, the horizontal transport means transports the object for processing in a first direction, which is a direction in the first orientation wherein the portion on the opposite side from the parts for gripping approaches the parts for gripping within the protective film, thereby releasing the protective film.

MITANI Takuro (32-12, Koroen, Settsu cit, Osaka 34, 〒5660034, JP)
Application Number:
Publication Date:
August 08, 2019
Filing Date:
September 18, 2018
Export Citation:
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MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. (32-12, Koroen Settsu cit, Osaka 34, 〒5660034, JP)
International Classes:
H01L21/683; B28D5/00; B28D7/04; C03B33/03; H01L21/301
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (10th floor, Sumitomo-seimei OBP Plaza Bldg. 4-70, Shiromi 1-chome, Chuo-ku, Osaka-sh, Osaka 01, 〒5400001, JP)
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