Title:
FILM REMOVING DEVICE, FILM REMOVING METHOD, AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2003/052805
Kind Code:
A1
Abstract:
A film removing device, comprising a substrate holding part (60) for holding a substrate having coated film, a laser beam source (63) for partially peeling off the coated film from the substrate by locally radiating laser beam at an alignment mark position (14) on the substrate placed on the substrate holding part, a fluid feed mechanism (113 to 116, 201, 202) having main nozzles (64, 172, 200) for feeding specified fluid to the alignment mark position, a collecting mechanism (90) having sucking ports (66a, 171, 193) for sucking, on the substrate, the specified fluid fed to the alignment mark position together with peeled film components, and guide members (65, 170, 191) for guiding the specified fluid jetted from the main nozzles to the alignment mark position and guiding the fluid to the sucking ports of the collecting mechanism so that the specified fluid and peeled film components do not diffuse nor leak to the periphery of the alignment mark position.
Inventors:
TERADA SHOUICHI (JP)
YOSHITAKA NAOTO (JP)
AKIMOTO MASAMI (JP)
YOSHITAKA NAOTO (JP)
AKIMOTO MASAMI (JP)
Application Number:
PCT/JP2002/013188
Publication Date:
June 26, 2003
Filing Date:
December 17, 2002
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
TERADA SHOUICHI (JP)
YOSHITAKA NAOTO (JP)
AKIMOTO MASAMI (JP)
TERADA SHOUICHI (JP)
YOSHITAKA NAOTO (JP)
AKIMOTO MASAMI (JP)
International Classes:
B08B7/00; B23K26/08; B23K26/14; H01L21/00; H01L23/544; (IPC1-7): H01L21/027; B05C5/00; B05C11/10; B05D3/00
Foreign References:
| JPH04354321A | 1992-12-08 | |||
| JPH03254111A | 1991-11-13 | |||
| JPH03254112A | 1991-11-13 | |||
| JPH05102007A | 1993-04-23 | |||
| JPH02298017A | 1990-12-10 |
Attorney, Agent or Firm:
Suzuye, Takehiko c/o SUZUYE & SUZUYE (7-2 Kasumigaseki 3-chom, Chiyoda-ku Tokyo, JP)
Download PDF:
Previous Patent: CUSTOMISED GOODS AND SERVICES DELIVERY METHOD
Next Patent: SELF-ALIGNED CONTACT ETCH WITH HIGH SENSITIVITY TO NITRIDE SHOULDER
Next Patent: SELF-ALIGNED CONTACT ETCH WITH HIGH SENSITIVITY TO NITRIDE SHOULDER