Title:
FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/004657
Kind Code:
A1
Abstract:
A film for a semiconductor comprises a support film, a second adhesive layer, a first adhesive layer, and a bonding layer stacked in this order. The film for a semiconductor allows a semiconductor wafer to be stacked on the bonding layer, supports the semiconductor wafer when the semiconductor wafer is diced, and is structured so as to be selectively peeled off at the interface between the first adhesive layer and the bonding layer when the cut and separated semiconductor wafer (semiconductor device) is picked up. The film for a semiconductor is stacked with a semiconductor wafer, which is cut and separated by dicing, and then the adhesive forces of the obtained semiconductor device are measured. The film for a semiconductor is characterized in that when the adhesive force at the edge portion of a semiconductor device is denoted by a (N/cm) and the adhesive force at the central portion (portion other than the edge portion) of the semiconductor device is denoted by b (N/cm), the ratio a/b is 1 to 4 inclusive. Since the ratio a/b is optimized, when picking up a semiconductor device, it is possible to reliably prevent problems such as cracks, breaks, etc., of the semiconductor device caused by a high load locally applied to the semiconductor device.
Inventors:
YASUDA HIROYUKI (JP)
HIRANO TAKASHI (JP)
HIRANO TAKASHI (JP)
Application Number:
PCT/JP2010/059188
Publication Date:
January 13, 2011
Filing Date:
May 31, 2010
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
YASUDA HIROYUKI (JP)
HIRANO TAKASHI (JP)
YASUDA HIROYUKI (JP)
HIRANO TAKASHI (JP)
International Classes:
H01L21/301; C09J5/00; C09J7/38; C09J201/00
Domestic Patent References:
| WO2008047610A1 | 2008-04-24 | |||
| WO2008032367A1 | 2008-03-20 |
Foreign References:
| JP2003142429A | 2003-05-16 | |||
| JP2003034780A | 2003-02-07 | |||
| JP2007027215A | 2007-02-01 |
Other References:
None
Attorney, Agent or Firm:
ASAHI Kazuo et al. (JP)
Morning ratio One husband (JP)
Morning ratio One husband (JP)
Download PDF:
Previous Patent: ANTENNA
Next Patent: FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Next Patent: FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD