Title:
FILM-SHAPED ADHESIVE AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/125537
Kind Code:
A1
Abstract:
Provided are: a film-shaped adhesive suitable as an NCF and being void-free, having excellent electrical connection properties and reliability thereof, having excellent surface flatness, and not being prone to cracking; and a semiconductor device which uses this film-shaped adhesive as an NCF during manufacturing of the semiconductor device. This film adhesive is characterized by containing an epoxy resin (A), a bisphenol-F-type phenoxy resin (B), a phenol-resin-based curing agent (C), a modified imidazole compound (D), a silica filler (E), oxyquinoline (F), and a butadiene/acrylonitrile/methacrylic acid copolymer, the content of component (A) being 19.3-33.8 parts by mass, the content of component (B) being 7.5-9.1 parts by mass, the content of component (D) being 1.915-5 parts by mass, the content of component (E) being 30-60 parts by mass, the content of component (F) being 2.5-10 parts by mass, the liquid epoxy resin of component (A) containing a phenol novolak-type epoxy resin and a liquid epoxy resin, the ratio of the phenol novolak-type epoxy resin in the epoxy resin of component (A) being 46% or greater, and the equivalent ratio of component (C) to component (A) being 0.25-0.75.
Inventors:
KAWAMOTO SATOMI (JP)
FUKUHARA YOSHIHIDE (JP)
SONE HIROMI (JP)
SAITO ATSUSHI (JP)
HOTCHI TOYOKAZU (JP)
FUKUHARA YOSHIHIDE (JP)
SONE HIROMI (JP)
SAITO ATSUSHI (JP)
HOTCHI TOYOKAZU (JP)
Application Number:
PCT/JP2016/050624
Publication Date:
August 11, 2016
Filing Date:
January 12, 2016
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L63/00; C09J7/10; C09J11/04; C09J11/06; C09J109/02; C09J161/04; C09J163/00; C09J163/04; C09J171/10; H01L21/60
Domestic Patent References:
| WO2011033743A1 | 2011-03-24 | |||
| WO2011048774A1 | 2011-04-28 | |||
| WO2010052871A1 | 2010-05-14 | |||
| WO2008004287A1 | 2008-01-10 |
Foreign References:
| JP2013171927A | 2013-09-02 | |||
| JPH11284114A | 1999-10-15 | |||
| JP2000017240A | 2000-01-18 | |||
| JP2002348486A | 2002-12-04 | |||
| JP2006225426A | 2006-08-31 | |||
| JP2015137299A | 2015-07-30 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
Mochitoshi Watanabe (JP)
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