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Title:
FILM-SHAPED FIRING MATERIAL AND SUPPORT-SHEET-EQUIPPED FILM-SHAPED FIRING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/054225
Kind Code:
A1
Abstract:
A film-shaped firing material 1 that contains sinterable metal particles 10 and a binder component 20, the sinterable metal particle 10 content being 15–98 mass%, and the binder component 20 content being 2–50 mass%. When the film-shaped firing material 1 is pressure-fired for 3 minutes at 350℃ and 10 MPa, the shrinkage factor of the film-shaped firing material 1 in the planar direction is no more than 10% relative to before firing, and the volume shrinkage factor of the film-shaped firing material 1 is 15%–90% relative to before firing. When the film-shaped firing material 1 is in contact with an adherend and pressure-fired for 3 minutes at 350℃ and 10 MPa, the percentage contact of the film-shaped firing material 1 with the adherend is at least 90% relative to the contact area of the adherend.

Inventors:
ICHIKAWA ISAO (JP)
NAKAYAMA HIDEKAZU (JP)
Application Number:
PCT/JP2018/032623
Publication Date:
March 21, 2019
Filing Date:
September 03, 2018
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
B22F7/08; B22F1/10; B22F7/04; B32B27/18; B82Y30/00; H01B1/22; H01L21/52
Foreign References:
JP2017069557A2017-04-06
JP2017069559A2017-04-06
JP2014224296A2014-12-04
JP2006321715A2006-11-30
JP2017177833A2017-10-05
JP2014111800A2014-06-19
Other References:
See also references of EP 3666429A4
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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