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Patent Searching and Data


Title:
FILM STRUCTURE, METHOD FOR PRODUCING FILM STRUCTURE AND APPARATUS FOR PRODUCING FILM STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/100266
Kind Code:
A1
Abstract:
The present invention provides a film structure (10) which sequentially comprises a substrate (1), a film (2) containing zirconia, a sacrificial layer (3) and a piezoelectric film (4) in this order, wherein: the substrate, the film containing zirconia, the sacrificial layer and the piezoelectric film are respectively single-crystallized; and the sacrificial layer can be selectively removed. The present invention also provides: a method for producing this film structure; and an apparatus for producing this film structure.

Inventors:
KONISHI AKIO (JP)
IIZUKA TAKESHI (JP)
KANAMORI HIROAKI (JP)
Application Number:
PCT/JP2021/043952
Publication Date:
June 08, 2023
Filing Date:
November 30, 2021
Export Citation:
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Assignee:
I PEX PIEZO SOLUTIONS INC (JP)
International Classes:
H01L41/187; H01L41/047; H01L41/29; H01L41/316
Domestic Patent References:
WO2020179210A12020-09-10
WO2020026735A12020-02-06
WO2020179210A12020-09-10
Foreign References:
JP2019216181A2019-12-19
US20190372543A12019-12-05
JP2019153858A2019-09-12
JP2007006001A2007-01-11
JP6498821B12019-04-10
Attorney, Agent or Firm:
KOH-EI, P.C. (JP)
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