Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FILM TEST STRUCTURE AND ARRAY SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/036200
Kind Code:
A1
Abstract:
A film test structure and an array substrate. The film test structure (100) comprises a conductive film (101) to be tested, a plurality of test lead-out wires (102) located at a layer different from the conductive film (101) to be tested and electrically connected to the conductive film (101) to be tested respectively, and a plurality of test terminals (103) electrically connected to the plurality of test lead-out wires (102) respectively. By applying the film test structure to an array substrate, a square resistance can be conveniently tested, and test accuracy can be ensured. In addition, test probes do not need to be frequently replaced, reducing the consumption of test probes, thereby reducing production costs.

Inventors:
ZHANG MIAO (CN)
SUN JING (CN)
FU WUXIA (CN)
Application Number:
PCT/CN2017/083195
Publication Date:
March 01, 2018
Filing Date:
May 05, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
H01L23/544; H01L27/12
Foreign References:
CN205959980U2017-02-15
CN202166811U2012-03-14
CN103217459A2013-07-24
CN104133333A2014-11-05
CN203217210U2013-09-25
CN103811469A2014-05-21
JP2007072325A2007-03-22
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
Download PDF: