FILM THICKNESS CONTROL DEVICE, FILM THICKNESS CONTROL METHOD, AND FILM FORMATION DEVICE

WIPO Patent Application WO/2016/009626

A1

[Problem] To provide a film thickness control device, a film thickness control method, and a film formation device with which it is possible to suppress excessive feedback control to a vapor deposition source caused by abnormal values. [Solution] A film thickness control device according to an embodiment of the present invention is a film thickness control device that measures a film formation rate on the basis of an oscillation frequency of an oscillator provided in a film formation device including a vapor deposition source, and that controls the vapor deposition source on the basis of the measured film formation rate, the film thickness control device comprising a rate calculation unit (431), a first filter unit (432), and a second filter unit (433). The rate calculation unit (431) calculates a rate conversion value per unit time on the basis of the oscillation frequency of the oscillator. The first filter unit (median computation unit (432)) is configured so as to remove abnormal values from the rate conversion values output from the rate calculation unit (431) (so as to calculate the median). The second filter unit (smoothing unit (433)) is configured so as to smooth the rate conversion values output from the first filter unit.

KOBAYASHI YOSHIKAZU (JP)
ITOU ATSUSHI (JP)
ENDO JIROU (JP)

PCT/JP2015/003491

January 21, 2016

July 10, 2015

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ULVAC INC (JP)

C23C14/52; G01B17/02

WO2009038085A1

2009-03-26

JP2000008164A	2000-01-11
JP2013011545A	2013-01-17

OMORI, JUNICHI (JP)
Omori Junichi (JP)

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