Title:
FILM THICKNESS MEASURING METHOD, FILM THICKNESS MEASURING DEVICE, POLISHING METHOD, AND POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/163352
Kind Code:
A1
Abstract:
The present invention relates to a film thickness measuring method that detects a film thickness by analyzing optical information contained in light reflected from a substrate. The film thickness measuring method includes the steps of generating a spectral waveform showing the relationship between the strength and wavelength of the reflected light from the substrate (W), determining the intensity of the frequency component and corresponding film thickness by performing a Fourier transformation process on the spectral waveform, determining the plurality of maximal values (M1, M2) of the intensity of the frequency component, and selecting one film thickness according to a selection standard from film thicknesses (t1, t2) corresponding respectively to the maximal values (M1, M2). The selection standard is either selecting the Nth largest film thickness or selecting the Nth smallest film thickness, wherein N is a natural number defined beforehand.
Inventors:
KIMBA TOSHIFUMI (JP)
Application Number:
PCT/JP2016/061100
Publication Date:
October 13, 2016
Filing Date:
April 05, 2016
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
G01B11/06; B24B37/013; B24B49/04; B24B49/12; H01L21/304
Foreign References:
| JP2009092454A | 2009-04-30 | |||
| JP2014216457A | 2014-11-17 | |||
| JP2013222856A | 2013-10-28 |
Attorney, Agent or Firm:
WATANABE, Isamu et al. (JP)
Isamu Watanabe (JP)
Isamu Watanabe (JP)
Download PDF: