Title:
FILM FOR VACUUM THERMAL INSULATOR
Document Type and Number:
WIPO Patent Application WO/2015/047022
Kind Code:
A1
Abstract:
The present invention provides a film for a vacuum thermal insulator, the film comprising: an interruption layer comprising at least two metal interruption layers, which have metal layers formed thereon, stacked on a surface of a substrate film by a first attachment layer; a heat bonding layer stacked on a surface of the interruption layer by a second attachment layer, the substrate film constituting the outermost layer of the opposite surface to the surface on which the heat bonding layer is stacked; and a first protection layer formed on a surface of at least one of the metal interruption layers. The present invention can substantially improve thermal insulation performance and gas interruption property and simultaneously prevent degradation of performance resulting from generation of pinholes during metal deposition.
Inventors:
KIM CHONG WON (KR)
KIM JIN-YOUNG (KR)
KIM JIN-YOUNG (KR)
Application Number:
PCT/KR2014/009191
Publication Date:
April 02, 2015
Filing Date:
September 30, 2014
Export Citation:
Assignee:
KOLON INC (KR)
International Classes:
B32B15/092; B32B27/26; F16L59/065
Foreign References:
| JP2011143692A | 2011-07-28 | |||
| JP2009121671A | 2009-06-04 | |||
| JP2010284854A | 2010-12-24 | |||
| KR20120038618A | 2012-04-24 | |||
| KR20100119937A | 2010-11-12 |
Attorney, Agent or Firm:
PLUS INTERNATIONAL IP LAW FIRM et al. (KR)
특허법인 플러스 (KR)
특허법인 플러스 (KR)
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