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Patent Searching and Data


Title:
FILM
Document Type and Number:
WIPO Patent Application WO/2017/145848
Kind Code:
A1
Abstract:
Provided is a film having a high tensile modulus of elasticity, and excellent heat resistance, impact resistance, and moldability. The film contains: a PEKK resin (A) having a repeating unit (a-1) represented by structural formula (1) and a repeating unit (a-2) represented by structural formula (2); and a polybiphenyl ether sulfone (PBPES) resin (B) having a repeating unit (b) represented by general formula (3), wherein the contained proportion of the PBPES resin (B) with respect to the sum of the contained amounts of the PEKK resin (A) and the PBPES resin (B) is 10-70 mass% (in formula (3): at least one of R1-R4 represents a sulfonyl group, at least one of R1-R4 represents an oxygen atom, and the remaining of R1-R4 each independently represent an oxygen atom, a sulfur atom, a sulfonyl group, or a carbonyl group; Ar1-Ar3 each independently represent an arylene group having 6-24 carbon atoms; m represents 0 or 1; and n represents 0 or 1.).

Inventors:
TANAKA KAZUYA (JP)
Application Number:
PCT/JP2017/005197
Publication Date:
August 31, 2017
Filing Date:
February 13, 2017
Export Citation:
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Assignee:
MITSUBISHI PLASTICS INC (JP)
International Classes:
C08L71/12; C08J5/18; C08L81/06
Foreign References:
JP2015533872A2015-11-26
JPH0820716A1996-01-23
JP2010525126A2010-07-22
JP2015193813A2015-11-05
JP2009280814A2009-12-03
JP2015521534A2015-07-30
Other References:
See also references of EP 3421543A4
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
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