Title:
FILMY ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/158490
Kind Code:
A1
Abstract:
The present invention discloses a filmy adhesive for bonding a semiconductor element and a support member on which the semiconductor element is mounted. The filmy adhesive contains a heat-curable resin component and a labelling agent.
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Inventors:
NAKAMURA KANAMI (JP)
HASHIMOTO SHINTARO (JP)
KUNITO YUI (JP)
TANIGUCHI KOHEI (JP)
OHHIRA HISANORI (JP)
HASHIMOTO SHINTARO (JP)
KUNITO YUI (JP)
TANIGUCHI KOHEI (JP)
OHHIRA HISANORI (JP)
Application Number:
PCT/JP2020/001788
Publication Date:
August 06, 2020
Filing Date:
January 20, 2020
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/52; C09J7/22; C09J7/35; C09J11/06; C09J201/00; H01L21/301
Foreign References:
| JP2017105883A | 2017-06-15 | |||
| JP2015081269A | 2015-04-27 | |||
| JP2012158631A | 2012-08-23 | |||
| JP2005307037A | 2005-11-04 | |||
| JP2011052109A | 2011-03-17 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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