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Patent Searching and Data


Title:
FINE ELECTROFORMING MOLD AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2003/071006
Kind Code:
A1
Abstract:
A fine electroforming mold having a simple structure which can be manufactured easily. In order to improve productivity of a metal product composed of a metal thin film, electrode portions to function as cathodes during electroforming can be arranged with a higher density and a metal thin film formed on the electrode portions can easily be peeled off. The mold has a staying power and can be used a plurality of times. There is also disclosed a manufacturing method for manufacturing the fine electroforming mold with a higher accuracy by an easier way. The fine electroforming mold (M) has a conductive substrate (1) to function as a cathode during electroforming. On the surface of the conductive substrate (1), an insulation layer (2) having an opening (21) reaching the conductive substrate (1) and having a shape corresponding to a shape of a metal product (P) when viewed from above is formed of an inorganic insulation material with a thickness T2 not smaller than 10 nm and smaller than 1/2 of thickness T1 of the metal product (P). The surface of the conductive substrate (1) exposed at the portion of the opening (21) is made to serve as an electrode portion. The manufacturing method is as follows. On the region excluding the area where a resist film (R) is pattern-formed on the surface of the conductive substrate (1), a single-layered or multi-layered inorganic film (2’) is formed to grow into the insulation layer (2) by the vapor phase growth method. After this, the resist film (R) is removed and the opening (21) having a shape corresponding to the shape of the metal product (P) viewed from above and reaching the conductive substrate (1) is formed in the inorganic thin film (2’).

Inventors:
NITTA KOJI (JP)
INAZAWA SHINJI (JP)
HOSOE AKIHISA (JP)
Application Number:
PCT/JP2003/001686
Publication Date:
August 28, 2003
Filing Date:
February 18, 2003
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
NITTA KOJI (JP)
INAZAWA SHINJI (JP)
HOSOE AKIHISA (JP)
International Classes:
C25D1/00; C25D1/10; (IPC1-7): C25D1/10
Domestic Patent References:
WO2001018280A12001-03-15
Foreign References:
US3878061A1975-04-15
JPS5530076B21980-08-08
JPS5934794B21984-08-24
JPS5137617B21976-10-16
Attorney, Agent or Firm:
Inaoka, Kosaku c/o Ai Association of Patent and Trademark Attorneys (12F Jyutakukinyukoko-Sumitomoseimei Bldg. 5-20, Minamihommachi 4-chome, Chuo-k, Osaka-shi Osaka, JP)
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