Title:
FINE SILVER-PLATED COPPER POWDER AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2011/125556
Kind Code:
A1
Abstract:
Disclosed is a fine silver-plated copper powder, wherein an ultra thin silver plating layer is formed on the surface of each ultra fine copper powder particle. Specifically disclosed is a fine silver-plated copper powder, which is composed of fine copper powder particles each provided with a silver plating film on the surface, and which is characterized in that: the weight of silver is 1-25% by mass; the particle diameter (D50) at the cumulative weight of 50% as determined by laser diffraction/scattering particle size distribution measurement is 1 μm or less; and the thickness of the silver plating film is from 0.1 nm to 0.2 μm.
Inventors:
HAGA,Takahiro (JX Nippon Mining & Metals Corporation1-2,Shirogane-cho 1-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
Application Number:
JP2011/057439
Publication Date:
October 13, 2011
Filing Date:
March 25, 2011
Export Citation:
Assignee:
JX Nippon Mining & Metals Corporation (6-3Otemachi 2-chome, Chiyoda-ku Tokyo, 64, 〒1008164, JP)
ＪＸ日鉱日石金属株式会社 (〒64 東京都千代田区大手町二丁目６番３号 Tokyo, 〒1008164, JP)
ＪＸ日鉱日石金属株式会社 (〒64 東京都千代田区大手町二丁目６番３号 Tokyo, 〒1008164, JP)
International Classes:
B22F1/02; B22F1/00; B22F9/20; H01B1/22; H01B5/00; H01B13/00
Attorney, Agent or Firm:
AXIS Patent International (Yushi Kogyo Kaikan, 13-11Nihonbashi 3-chome,Chuo-k, Tokyo 27, 〒1030027, JP)
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Claims:
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