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Patent Searching and Data


Title:
FINE SILVER-PLATED COPPER POWDER AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2011/125556
Kind Code:
A1
Abstract:
Disclosed is a fine silver-plated copper powder, wherein an ultra thin silver plating layer is formed on the surface of each ultra fine copper powder particle. Specifically disclosed is a fine silver-plated copper powder, which is composed of fine copper powder particles each provided with a silver plating film on the surface, and which is characterized in that: the weight of silver is 1-25% by mass; the particle diameter (D50) at the cumulative weight of 50% as determined by laser diffraction/scattering particle size distribution measurement is 1 μm or less; and the thickness of the silver plating film is from 0.1 nm to 0.2 μm.

Inventors:
HAGA TAKAHIRO (JP)
Application Number:
PCT/JP2011/057439
Publication Date:
October 13, 2011
Filing Date:
March 25, 2011
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
HAGA TAKAHIRO (JP)
International Classes:
B22F1/17; B22F9/20; H01B1/22; H01B5/00; H01B13/00
Domestic Patent References:
WO2009001710A12008-12-31
WO2008059789A12008-05-22
Foreign References:
JP2010065260A2010-03-25
JP2007224420A2007-09-06
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
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Claims: