Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FINE-WIRING FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/204553
Kind Code:
A1
Abstract:
The present invention relates to a fine-wiring flexible circuit board for forming double-sided wiring on both a top part and a bottom part of an insulation layer of a flexible board, and a manufacturing method therefor.

Inventors:
PARK KWANG SOO (KR)
Application Number:
KR2017/005402
Publication Date:
November 30, 2017
Filing Date:
May 24, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FINE CHEM CO LTD (KR)
International Classes:
H05K3/40; H05K1/03; H05K3/18; H05K3/28
Foreign References:
JP2006332280A2006-12-07
KR101466524B12014-11-27
JPH05198946A1993-08-06
JP2006019522A2006-01-19
US20100266850A12010-10-21
Attorney, Agent or Firm:
GHONG-GAN INTERNATIONAL PATENT LAW FIRM (KR)
Download PDF: