Title:
FINGERPRINT MODULE
Document Type and Number:
WIPO Patent Application WO/2018/133059
Kind Code:
A1
Abstract:
A fingerprint module, which relates to the field of biometric identification, the fingerprint module comprising: a cover plate (1), a sensor package (2), a circuit board (4), support frames (3) and a binding agent (5); an ink layer (11) is provided at a lower surface of said cover plate (1), said sensor package (2) being located at a lower side of said ink layer (11), while the lower side of said ink layer (11) is covered with the binding agent (5), said cover plate (1) being fixedly connected to said sensor package (2) by means of the binding agent (5) on the lower side of said ink layer (11); said sensor package (2) is fixed on an upper side of said circuit board (4), a support frame (3) being provided at two sides of said circuit board (4); gaps between said constituent parts are filled with said binding agent (5). Compared with the existing technology, said fingerprint module has better structural stability and thinner overall thickness, and thus more space may be saved in the application of the device as a whole, having better application efficiency.
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Inventors:
XU WEITIAN (CN)
GUO YIPING (CN)
GUO YIPING (CN)
Application Number:
PCT/CN2017/072042
Publication Date:
July 26, 2018
Filing Date:
January 22, 2017
Export Citation:
Assignee:
SHENZHEN GOODIX TECH CO LTD (CN)
International Classes:
G06K9/00
Foreign References:
| CN105117715A | 2015-12-02 | |||
| CN105260707A | 2016-01-20 | |||
| CN105117714A | 2015-12-02 | |||
| CN104615981A | 2015-05-13 | |||
| CN105046244A | 2015-11-11 |
Other References:
See also references of EP 3422248A4
Attorney, Agent or Firm:
BEIJING TIAN QI ZHI XIN INTELLECTUAL PROPERTY AGENCY CO., LTD (CN)
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