Title:
FINGERPRINT RECOGNITION MODULE AND MOBILE TERMINAL
Document Type and Number:
WIPO Patent Application WO/2018/133764
Kind Code:
A1
Abstract:
An embodiment of the present invention provides a fingerprint recognition module. The fingerprint recognition module comprises a fingerprint chip assembly, a metal pattern, and a circuit board. The fingerprint chip assembly is disposed in the metal pattern. The fingerprint chip assembly is electrically connected to the circuit board, and the circuit board is provided with a grounding ring. The metal pattern is separated from the grounding ring by means of a dielectric material, so as to form a coupling capacitor between the metal pattern and the grounding ring. In the present invention, static electricity on the metal pattern can be released to a main ground through the coupling capacitor, and the coupling capacitor can isolate the leakage of a current when the charging current is leaked, thereby improving the safety of the fingerprint recognition module. A mobile terminal in the present invention can isolate the leakage of the current, thereby improving the security of the mobile terminal.
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Inventors:
ZHANG HAIPING (CN)
Application Number:
PCT/CN2018/072653
Publication Date:
July 26, 2018
Filing Date:
January 15, 2018
Export Citation:
Assignee:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
International Classes:
H04M1/02
Foreign References:
| CN106657478A | 2017-05-10 | |||
| CN106250872A | 2016-12-21 | |||
| CN105591360A | 2016-05-18 | |||
| CN201063677Y | 2008-05-21 | |||
| CN105101700A | 2015-11-25 | |||
| US20160379036A1 | 2016-12-29 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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