Title:
FINGERPRINT RECOGNITION MODULE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/010158
Kind Code:
A1
Abstract:
The present invention relates to the technical field of fingerprint recognition. Disclosed are a fingerprint recognition module and a preparation method therefor. The fingerprint recognition module is obtained by cutting a board-level module, and comprises a fingerprint recognition chip, a filling material, a colored coating, and a cover plate. The colored coating is positioned between the filling material and the cover plate. The fingerprint recognition chip is attached upside-down into a hollow region of the filling material in a vacuum environment. The module is simply structured and easy to fabricate. The preparation method can effectively eliminate bubbles between the fingerprint recognition chip and the cover plate, thereby improving the preparation efficiency of the fingerprint recognition module.
Inventors:
WU BAOQUAN (CN)
LONG WEI (CN)
LONG WEI (CN)
Application Number:
PCT/CN2016/090101
Publication Date:
January 18, 2018
Filing Date:
July 15, 2016
Export Citation:
Assignee:
SHENZHEN GOODIX TECH CO LTD (CN)
International Classes:
H01L23/31
Foreign References:
| CN105068685A | 2015-11-18 | |||
| CN103198547A | 2013-07-10 | |||
| CN104916549A | 2015-09-16 | |||
| CN105046244A | 2015-11-11 |
Other References:
See also references of EP 3288072A4
Attorney, Agent or Firm:
BEIJING TIAN QI ZHI XIN INTELLECTUAL PROPERTY AGENCY CO., LTD (CN)
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