Title:
FIRST PROTECTION FILM FORMING SHEET
Document Type and Number:
WIPO Patent Application WO/2018/066302
Kind Code:
A1
Abstract:
This first protection film forming sheet is provided with a first base material, a buffer layer formed on the first base material, and a curable resin film formed on the buffer layer. When test pieces for each of the buffer layer and the curable resin film are fabricated having a diameter of 8 mm and a thickness of 1 mm, and a strain distribution measurement is performed to measure the shearing modulus G' of the test pieces by producing a strain in the test pieces under conditions of 90°C and 1 Hz, a shearing modulus Gb300' of the test piece for the buffer layer when the test piece for the buffer layer has a strain of 300%, and a shearing modulus Gc300' of the test piece for the curable resin film when the test piece for the curable resin film has a strain of 300% satisfy the relationship Gb300' ≥ Gc300'.
Inventors:
YAMAGISHI MASANORI (JP)
ADACHI ISSEI (JP)
ADACHI ISSEI (JP)
Application Number:
PCT/JP2017/032468
Publication Date:
April 12, 2018
Filing Date:
September 08, 2017
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/304; H01L21/301
Foreign References:
| JP2012169484A | 2012-09-06 | |||
| JP2015206006A | 2015-11-19 | |||
| JP2015084352A | 2015-04-30 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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