Title:
FIRST PROTECTIVE FILM FORMING SHEET
Document Type and Number:
WIPO Patent Application WO/2017/078052
Kind Code:
A1
Abstract:
Provided is a first protective film forming sheet obtained by layering a first adhesive layer on a first substrate and layering a curable resin layer on the first adhesive layer. The curable resin layer is for forming a first protective film on the bump-equipped surface of a semiconductor wafer by adhering to said surface and being cured. The interlayer peeling force (1) between the first adhesive layer and the curable resin layer after the curable resin layer is laminated onto the first adhesive layer and cured is greater than the interlayer peeling force (2) between the curable resin layer and a mirror-polished surface of lead-free solder SAC305 after the curable resin layer is laminated onto the mirror-polished surface of lead-free solder SAC305 and cured. The interlayer peeling force (1) is 2.0-100N/25mm.
Inventors:
YAMAGISHI MASANORI (JP)
SATO AKINORI (JP)
SATO AKINORI (JP)
Application Number:
PCT/JP2016/082543
Publication Date:
May 11, 2017
Filing Date:
November 02, 2016
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/60; B32B27/00; H01L21/56; H01L23/29; H01L23/31
Foreign References:
| JP2012169484A | 2012-09-06 | |||
| JP2012169482A | 2012-09-06 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
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