FIXING STRUCTURE OF WIRING MEMBER

WIPO Patent Application WO/2020/031650

A1

The purpose of the present invention is to provide technology which can suppress the thermal dose for adhesion even when heating a hot-melt adhesive with a linear transmission member being in contact with the hot-melt adhesive. This fixing structure of a wiring member includes an adhesion member, a linear transmission member, and an adherend. The adhesion member includes a planar substrate having conductivity, a first hot-melt adhesive which is provided on one major surface of the substrate, and a second hot-melt adhesive which is provided on the other major surface of the substrate. The substrate can generate heat by dielectric heating by a dielectric heating device. The linear transmission member is adhered to the adhesion member by being adhered to the first hot-melt adhesive on the one major surface side of the substrate. The adherend is adhered to the adhesion member by being adhered to the second hot-melt adhesive on the other major surface side of the substrate.

JP3228405

Floor-standing extension cord

FUKUSHIMA DAICHI (JP)
HIRAI HIROKI (JP)
HIGASHIKOZONO MAKOTO (JP)
MIZUNO HOUSEI (JP)
ARAMAKI MIYU (JP)

PCT/JP2019/028284

February 13, 2020

July 18, 2019

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AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)

H02G3/30; C09J7/35; C09J201/00; H01B7/40

JP2013535182A	2013-09-09
JP2002112440A	2002-04-12
JP2005179420A	2005-07-07

YOSHITAKE Hidetoshi et al. (JP)

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